Did lithography at UIC for the NFAP project first time this year. It was originally planned to be finished on 12/4/03, when the photoresist was spin-coated. But, since swamped with other works, it was just done today. 9 wafers were processed. Thermal treatment of PR at 80°C for 30 min, followed by selection of sharp tip groups. Then, wafers were aligned, exposed and developed. [0930:2030]