Oxygen plasma RIE for NF probe chips and PDMS films. The front sidesof the two chips were covered by the PDMS covers. PDMS pieces were cut out from a large spin-coated PDMS film on a glass substrate. ~5 pieces were cut, flipped and placed on another glass slide for RIE treatment. Parameters used were specified on the log yesterday. After the treatment, when place over the chips for cover, the PDMS pieces didn't want stick to the surface. The RIE-treated surface was put facing the front side of the chip. Another set of PDMS pieces were treated and placed over, but it didn't work either. Then, the whole film on the glass slide was RIE-treated, in which the opposite side of the one treated previously. Pieces were cut off, filpped, and then the other side was treated. In that way, both sides of the pieces were treated. After this, the pieces stayed well stuck to the chip surface.